Solar Cell Cutting by BLITZ-OEM Laser System
The high beam quality and energy density of BLITZ-OEM System allows a high definition of the cut line (<20mm) combining chip free edges, high cutting speed and handling simplification. The high energy density of the beam, makes this laser system suitable to cut also materials with low absorption in the 1060nm band. Several materials like Si, a-Si, Ge, GaAs and InP can be cut with good edge quality by BLITZ-OEM System; in the following figure an example of a GaAs/Ge solar cell cut is reported.